Flexure amplified piezo actuator for focus adjustment

ABSTRACT

A camera includes a camera focus adjustment device, a lens, and an image sensor coupled to the camera focus adjustment device. The camera focus adjustment device includes a flexure structure. The flexure structure includes an outer framework of structural members continuously interconnected by flexure notch hinges. The flexure structure also includes two inner structural members oriented in parallel and extending from the outer framework of structural members. A gap is between the two inner structural members. The camera focus adjustment device also includes a piezoelectric material within the gap and a pair of wedges within the gap. The pair of wedges is affixed to the piezoelectric material and to one inner structural member of the two inner structural members. Based on temperature-based piezoelectric activity associated with the piezoelectric material, the camera focus adjustment device is operable to move the image sensor relative to the lens.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a continuation of U.S. patent applicationSer. No. 17/132,667, filed Dec. 23, 2020, the content of which isherewith incorporated by reference.

BACKGROUND

Autonomous vehicles or vehicles operating in an autonomous mode may beequipped with one or more sensors configured to detect information aboutan environment in which the vehicle operates. As a non-limiting example,high-resolution cameras may be used to capture high-resolution images ofthe environment surrounding an autonomous vehicle. The high-resolutionimages are typically processed to identify objects and conditionsexternal to the autonomous vehicle, and operation of the autonomousvehicle can be adjusted based on the identified objects and conditionsdepicted in the high-resolution images. As a non-limiting example, acommand may be generated to stop the autonomous vehicle if thehigh-resolution images depict a stop sign.

Typically, an image sensor of a high-resolution camera is positionedwithin a threshold distance from a lens of the high-resolution camera toprovide a range of image focus capability. However, the distance betweenthe image sensor and the lens can fluctuate based on temperature. Forexample, the distance between the image sensor and the lens may expandin warmer temperatures, and the distance between the image sensor andthe lens may contract in cooler temperatures. In some scenarios, thehigh-resolution camera can be subject to ambient temperatures rangingfrom −30° Celsius to 85° Celsius. This wide range of ambienttemperatures can cause distance fluctuations between the image sensorand the lens, which in turn, can impact the image focus capability ofthe high-resolution camera.

SUMMARY

The present disclosure generally relates to a camera focus adjustmentdevice formed from a piezoelectric actuator wedged into a flexurestructure. According to the methods and techniques described herein, thecamera focus adjustment device can be used to move an image sensor of acamera relative to a lens of the camera to provide a range of focuscapability.

The flexure structure may include an outer framework of structuralmembers that are interconnected using flexure notch hinges. Thepiezoelectric actuator (e.g., a piezoelectric stack) can be loadedbetween two inner structural members of the flexure structure using apair of wedges. As a non-limiting example, the wedges can be loaded suchthat the piezoelectric material has a compressive stress pressure ofapproximately fifteen (15) Megapascals (MPa). The wedges are constructed(e.g., designed) such that wedges are affixed at an angle, such as an 85degree angle, that holds the wedges in place.

Contraction of the piezoelectric material, based on an increasedtemperature, can cause displacement (e.g., expansion in the verticaldirection) of the flexure structure. As a non-limiting example, if thepiezoelectric material is exposed to a relatively warm environment, thepiezoelectric material may contract. Contraction of the piezoelectricmaterial may cause the flexure notch hinges of the flexure structure todisplace (e.g., raise) the flexure structure. Thus, if the image sensorof the camera is coupled to the flexure structure, the image sensor canbe raised by the flexure structure in response to exposure of thepiezoelectric material to the relatively warm environment. Raising theimage sensor can substantially offset any distance fluctuations betweenthe image sensor and the lens due to exposure to the relatively warmenvironment.

In a first aspect, a camera focus adjustment device includes a flexurestructure, a pair of wedges, and a piezoelectric material. The flexurestructure includes a plurality of structural members continuouslyinterconnected by flexure notch hinges. The plurality of structuralmembers includes a first horizontal structural member affixed to animage sensor of a camera and a second horizontal structural memberoriented in parallel to the first horizontal structural member. Thesecond horizontal structural member is rigidly affixed to a surface. Theplurality of structural members also includes a first verticalstructural member oriented perpendicularly to the first horizontalstructural member and a second vertical structural member orientedperpendicularly to first horizontal structural member. The plurality ofstructural members further includes a third horizontal structural memberextending from the first vertical structural member and oriented inparallel to the first horizontal structural member. The plurality ofstructural members also includes a fourth horizontal structural memberextending from the second vertical structural member and oriented inparallel to the first horizontal structural member. The plurality ofstructural members also includes a first upper structural memberconnected to the first horizontal structural member and to the firstvertical structural member. The plurality of structural members alsoincludes a second upper structural member connected to the firsthorizontal structural member and to the second vertical structuralmember. The plurality of structural members also includes a first lowerstructural member connected to the second horizontal structural memberand to the first vertical structural member. The plurality of structuralmembers also includes a second lower structural member connected to thesecond horizontal structural member and to the second verticalstructural member. The pair of wedges is affixed to the third horizontalstructural member, and the piezoelectric material is affixed to the pairof wedges and to the fourth horizontal structural member. Expansion andcontraction of the piezoelectric material causes the flexure notchhinges to displace the flexure structure.

In a second aspect, a camera includes a camera focus adjustment device,a lens, and an image sensor coupled to the camera focus adjustmentdevice. The image sensor is located between the camera focus adjustmentdevice and the lens. The camera focus adjustment device includes aflexure structure. The flexure structure includes an outer framework ofstructural members continuously interconnected by flexure notch hinges.The flexure structure also includes two inner structural membersoriented in parallel and extending from the outer framework ofstructural members. A gap is between the two inner structural members.The camera focus adjustment device also includes a piezoelectricmaterial within the gap and a pair of wedges within the gap. The pair ofwedges is affixed to the piezoelectric material and to one innerstructural member of the two inner structural members. Based ontemperature-based piezoelectric activity associated with thepiezoelectric material, the camera focus adjustment device is operableto move the image sensor relative to the lens.

In a third aspect, a method of loading a camera focus adjustment deviceincludes inserting piezoelectric material in a gap between two innerstructural members of a flexure structure of the camera focus adjustmentdevice. The flexure structure includes an outer framework of structuralmembers continuously interconnected by flexure notch hinges and the twoinner structural members. The two inner structural members oriented inparallel and extending from the outer framework of structural members.The method also includes applying a compressive stress pressure to thepiezoelectric material by loading a first wedge between a first innerstructural member of the two inner structural members and thepiezoelectric material. The method further includes applying additionalcompressive stress pressure to the piezoelectric material by loading asecond wedge between the first inner structural member and the firstwedge. The first wedge and the second wedge are affixed at an 85 degreeangle.

Other aspects, embodiments, and implementations will become apparent tothose of ordinary skill in the art by reading the following detaileddescription, with reference where appropriate to the accompanyingdrawings.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a cross-sectional diagram of a camera focus adjustment device,in accordance with an example embodiment.

FIG. 2 is a three-dimensional diagram of a flexure structure of thecamera focus adjustment device, in accordance with an exampleembodiment.

FIG. 3 is a three-dimensional diagram of the flexure structure with apiezoelectric material, in accordance with an example embodiment.

FIG. 4 is a three-dimensional diagram of the camera focus adjustmentdevice, in accordance with an example embodiment.

FIG. 5 is a diagram illustrating the process of loading thepiezoelectric material with wedges, in accordance with an exampleembodiment.

FIG. 6 is a diagram of a camera that includes the camera focusadjustment device, in accordance with an example embodiment.

FIG. 7 is a three-dimensional diagram of the camera focus adjustmentdevice coupled to an image sensor, in accordance with an exampleembodiment.

FIG. 8 is a diagram of an autonomous vehicle, in accordance with anexample embodiment.

FIG. 9 is a flowchart of a method, according to an example embodiment.

DETAILED DESCRIPTION

Example methods, devices, and systems are described herein. It should beunderstood that the words “example” and “exemplary” are used herein tomean “serving as an example, instance, or illustration.” Any embodimentor feature described herein as being an “example” or “exemplary” is notnecessarily to be construed as preferred or advantageous over otherembodiments or features. Other embodiments can be utilized, and otherchanges can be made, without departing from the scope of the subjectmatter presented herein.

Thus, the example embodiments described herein are not meant to belimiting. Aspects of the present disclosure, as generally describedherein, and illustrated in the figures, can be arranged, substituted,combined, separated, and designed in a wide variety of differentconfigurations, all of which are contemplated herein.

Further, unless context suggests otherwise, the features illustrated ineach of the figures may be used in combination with one another. Thus,the figures should be generally viewed as component aspects of one ormore overall embodiments, with the understanding that not allillustrated features are necessary for each embodiment.

I. OVERVIEW

The present disclosure generally relates to a camera focus adjustmentdevice formed from a piezoelectric material wedged into a flexurestructure. According to the methods and techniques described herein, thecamera focus adjustment device can be used to move an image sensor of acamera (attached to an autonomous vehicle) relative to a lens of thecamera to provide a range of focus capability.

The flexure structure as described herein includes structural membersthat are interconnected using flexure notch hinges. For example, anouter framework of the flexure structure includes two horizontalstructural members (e.g., a top and bottom horizontal structural member)oriented in parallel and two vertical structural members (e.g., a leftand right vertical structural member) oriented perpendicularly to thehorizontal structural members. To complete the outer framework of theflexure structure, the top horizontal structural member is connected tothe vertical structural members using a pair of corresponding upperstructural members, and the bottom horizontal structural member isconnected to the vertical structural members using a pair ofcorresponding lower structural members. Thus, the outer framework of theflexure structure can include eight structural members that areinterconnected using flexure notch hinges.

The piezoelectric material (e.g., a piezoelectric stack or apiezoelectric actuator) can be loaded between two inner structuralmembers of the flexure structure. For example, a first inner structuralmember extends from the left vertical structural member and is orientedin parallel to the horizontal structural members, and a second innerstructural member extends from the right vertical structural member andis oriented in parallel to the horizontal structural members. Thepiezoelectric material may be placed in a gap between the two innerstructural members in a zero stress state. After placing thepiezoelectric material in the gap, a first wedge and a second wedge areloaded between the first inner structural member and the piezoelectricmaterial to add a compressive stress pressure to the piezoelectricmaterial. As a non-limiting example, the wedges can be loaded such thatthe piezoelectric material has a compressive stress pressure ofapproximately fifteen (15) Megapascal (MPa). The wedges are constructed(e.g., designed) such that wedges are affixed at an angle, such as an 85degree angle, that holds the wedges in place.

Contraction of the piezoelectric material, based on an increasedtemperature, can cause displacement (e.g., expansion in the verticaldirection) of the flexure structure. As a non-limiting example, if thepiezoelectric material is exposed to a relatively warm environment, thepiezoelectric material may contract by a particular distance, such as byapproximately 15 micrometers (μm). Contraction of the piezoelectricmaterial may cause the flexure notch hinges of the flexure structure todisplace (e.g., raise) the flexure structure in such a manner that thetop horizontal structural member is raised by 105 μm (e.g.,approximately seven times the contraction distance of the piezoelectricmaterial). Thus, if the image sensor of the camera is coupled to the tophorizontal structural member, the image sensor can be raised by theflexure structure in response to exposure of the piezoelectric materialto the relatively warm environment. Raising the image sensor cansubstantially offset any distance fluctuations between the image sensorand the lens due to exposure to the relatively warm environment. As anon-limiting example, if the distance between the image sensor and thelens expands by approximately 105 μm due to an increase in environmentaltemperature, the expansion can be offset by flexure structure raisingthe image sensor by 105 μm.

Conversely, expansion of the piezoelectric material, based on adecreased temperature, can cause displacement (e.g., contraction in thevertical direction) of the flexure structure. As a non-limiting example,if the piezoelectric material is exposed to a relatively coolenvironment, the piezoelectric material may expand by a particulardistance, such as by approximately 15 μm. Expansion of the piezoelectricmaterial may cause the flexure notch hinges of the flexure structure todisplace (e.g., lower) the flexure structure in such a manner that thetop horizontal structural member is lowered by 105 μm (e.g.,approximately seven times the expansion distance of the piezoelectricmaterial). Thus, if the image sensor of the camera is coupled to the tophorizontal structural member, the image sensor can be lowered by theflexure structure in response to exposure of the piezoelectric materialto the relatively cool environment. Lowering the image sensor cansubstantially offset any distance changes between the image sensor andthe lens due to exposure to the relatively cool environment. As anon-limiting example, if the distance between the image sensor and thelens is shortened by approximately 105 μm due to a decrease inenvironmental temperature, the shortened distance can be offset byflexure structure lowering the image sensor by 105 μm.

Thus, the camera focus adjustment device can move the image sensor tocompensate for temperature-based distance fluctuations between the imagesensor and the lens. As a result, the camera can experience a relativelylarge range of focus capability. It should be appreciated that thepiezoelectric material may also contract or expand in response to aninput voltage, such as a 100 volt (V) signal.

II. EXAMPLE EMBODIMENTS

Particular implementations are described herein with reference to thedrawings. In the description, common features are designated by commonreference numbers throughout the drawings. In some drawings, multipleinstances of a particular type of feature are used. Although thesefeatures are physically and/or logically distinct, the same referencenumber is used for each, and the different instances are distinguishedby addition of a letter to the reference number. When the features as agroup or a type are referred to herein (e.g., when no particular one ofthe features is being referenced), the reference number is used withouta distinguishing letter. However, when one particular feature ofmultiple features of the same type is referred to herein, the referencenumber is used with the distinguishing letter. For example, referring toFIG. 1 , the multiple flexure notch hinges are illustrated andassociated with reference numbers 150A, 150B, 150C, etc. When referringto a particular one of the flexure notch hinges, such as the flexurenotch hinge 150A, the distinguishing letter “A” is used. However, whenreferring to any arbitrary one of these flexure notch hinges or to theseflexure notch hinges as a group, the reference number 150 is usedwithout a distinguishing letter.

FIG. 1 is a cross-sectional diagram of a camera focus adjustment device100, in accordance with an example embodiment. As described in greaterdetail with respect to FIG. 6 , the camera focus adjustment device 100is operable to reposition (e.g., move in the z-direction) an imagesensor of a camera with respect to a lens of the camera to improve animage focus capability of the camera. As a non-limiting example, thecamera focus adjustment device 100 is operable to move the image sensorin such a manner to ensure that the distance between the image sensorand the lens is within a threshold distance (e.g., ten (10) micrometers(μm)) over a relatively large temperature range. Keeping the imagesensor and the lens within the threshold distance may ensure the camerahas relatively high focus capabilities.

The camera focus adjustment device 100 includes a flexure structure 102.The flexure structure 102 includes a plurality of structural memberscontinuously interconnected by flexure notch hinges 150A-150H. Theflexure notch hinges 150 can be manufactured using a conventionalmachining process as opposed to an electrical discharge machining (EDM)process to improve a cost of manufacturing. As illustrated in FIG. 1 ,the plurality of structural members includes a first horizontalstructural member 110, a second horizontal structural member 112, afirst vertical structural member 114, a second vertical structuralmember 116, a third horizontal structural member 118, a fourthhorizontal structural member 120, a first upper structural member 122, asecond upper structural member 124, a first lower structural member 126,and a second lower structural member 128. The structural members 110,112, 114, 116, 122, 124, 126, 128 form an outer framework of the flexurestructure 102, and the structural members 118, 120 are inner structuralmembers of the flexure structure 102.

As shown in FIG. 1 , the second horizontal structural member 112 (e.g.,the bottom horizontal structural member) is oriented in parallel to thefirst horizontal structural member 110 (e.g., the top horizontalstructural member). The first vertical structural member 114 (e.g., theleft vertical structural member) is oriented perpendicularly to thehorizontal structural members 110, 112, and the second verticalstructural member 116 (e.g., the right vertical structural member) isoriented perpendicularly to the horizontal structural members 110, 112.The first upper structural member 122 is connected to the firsthorizontal structural member 110 via a flexure notch hinge 150A, and thefirst upper structural member 122 is connected to the first verticalstructural member 114 via a flexure notch hinge 150C. The second upperstructural member 124 is connected to the first horizontal structuralmember 110 via a flexure notch hinge 150B, and the second upperstructural member 124 is connected to the second vertical structuralmember 116 via a flexure notch hinge 150D. The first lower structuralmember 126 is connected to the second horizontal structural member 112via a flexure notch hinge 150E, and the first lower structural member126 is connected to the first vertical structural member 114 via aflexure notch hinge 114. The second lower structural member 128 isconnected to the second horizontal structural member 112 via a flexurenotch hinge 150F, and the second lower structural member 128 isconnected to the second vertical structural member 114 via a flexurenotch hinge 150H. As illustrated in FIG. 1 , the structural members 110,112, 114, 116, 122, 124, 126, 128 form an outer framework of the flexurestructure 102.

The third horizontal structural member 118 extends from the firstvertical structural member 114 and is oriented in parallel to the firsthorizontal structural member 110. The fourth horizontal structuralmember 120 extends from the second vertical structural member 116 and isoriented in parallel to the first horizontal structural member 110. Agap between the third horizontal structural member 118 and the fourthhorizontal structural member 120 is used to load a piezoelectricmaterial 134 (e.g., a piezo stack or a piezoelectric actuator) using apair of wedges 130, 132. The gap is shown in greater detail with respectto the three-dimensional illustration of the flexure structure 102 inFIG. 2 .

The piezoelectric material 134 is placed in the gap in a zero stressstate. After placing the piezoelectric material 134 in the gap, the pairof wedges 130, 132 is loaded between the third horizontal structuralmember 118 and the piezoelectric material 134 to add a compressivestress pressure to the piezoelectric material 134. As a non-limitingexample, the wedges 130, 132 can be loaded such that the piezoelectricmaterial 134 has a compressive stress pressure of approximately fifteen(15) Megapascals (MPa).

According to some implementations, the flexure structure 102 iscomprised of a high carbon martensitic stainless steel, such as a 440Cstainless steel or a 440F stainless steel. In some scenarios, thematerial of the flexure structure 102 is selected to reduce a differencebetween a coefficient of thermal expansion (CTE) of the flexurestructure 102 and a CTE of the piezoelectric material 134. As anon-limiting example, if 440F stainless steel is selected for theflexure structure 102, the CTE in the x-direction for the flexurestructure 102 may be approximately ten (10) parts per million (ppm) andthe CTE for the piezoelectric material 134 along the actuation axis maybe approximately negative five (−5) ppm due to the pyroelectric effect.The CTE in the z-direction for the flexure structure 102 may besubstantially less than the CTE in the x-direction because, as describedbelow, expansion of the flexure structure 102 x-direction causes thecontraction of the flexure structure 102 in the z-direction.

The dimensions of the camera focus adjustment device 100 can vary basedon implementation. According to one implementation, the length of theflexure structure 102 is approximately forty (40) millimeters (mm), theheight of the flexure structure 102 is approximately ten (10) mm, andthe width of the flexure structure is approximately five (5) mm.According to one implementation, the length of the piezoelectricmaterial 134 is approximately eighteen (18) mm, the height of thepiezoelectric material 134 is approximately three (3) mm, and the widthof the piezoelectric material 134 is approximately two (2) mm. It shouldbe understood that these dimensions are merely illustrative and shouldnot be construed as limiting.

If the flexure structure 102 is in a zero stress state, as illustratedin FIG. 1 , the upper structural members 122, 124 and the lowerstructural members 126, 128 may be oriented along a similar absoluteangle with respect to the x-direction (e.g., the directional orientationof the horizontal structural members 110, 112). According to oneexample, the flexure notch hinges 150 may be designed such that theupper structural members 122, 124 and the lower structural members 126,128 are oriented along an absolute angle of three (3) degrees withrespect to the x-direction. In this embodiment, the orientation angle(θ) of the first upper structural member 122 with respect to thex-direction is approximately three (3) degrees. In this scenario, theabsolute orientation angles of the second upper structural member 124and the lower structural members 126, 128 may be substantially similar.

During operation, contraction of the piezoelectric material 134, basedon an increased temperature, can cause displacement (e.g., expansion inthe z-direction) of the flexure structure 102. As a non-limitingexample, if the piezoelectric material 134 is exposed to a relativelywarm environment, the piezoelectric material 134 may contract by aparticular distance in the x-direction, such as by approximately 15micrometers (μm). Contraction of the piezoelectric material 134 maycause the flexure notch hinges 150 of the flexure structure 102 todisplace (e.g., raise) the flexure structure 102 in such a manner thatthe first horizontal structural member 110 is raised by 105 μm (e.g.,approximately seven times the contraction distance of the piezoelectricmaterial 134). Thus, if an image sensor of a camera is coupled to thefirst horizontal structural member 110, as described below with respectto FIG. 6 , the image sensor can be raised (in the z-direction) by theflexure structure 102 in response to exposure of the piezoelectricmaterial 134 to the relatively warm environment. Raising the imagesensor can substantially offset any distance changes between the imagesensor and a lens due to exposure to the relatively warm environment. Asa non-limiting example, if the distance between the image sensor and thelens expands by approximately 105 μm due to an increase in environmentaltemperature, the expansion can be offset by flexure structure 102raising the image sensor by 105 μm.

Expansion of the piezoelectric material 134, based on a decreasedtemperature, can cause displacement (e.g., contraction in thez-direction) of the flexure structure 102. As a non-limiting example, ifthe piezoelectric material 134 is exposed to a relatively coolenvironment, the piezoelectric material 134 may expand by a particulardistance x-direction, such as by approximately 15 μm. Expansion of thepiezoelectric material 134 may cause the flexure notch hinges 150 of theflexure structure 102 to displace (e.g., lower) the flexure structure102 in such a manner that the first horizontal structural member 110 islowered by 105 μm (e.g., approximately seven times the expansiondistance of the piezoelectric material 134). Thus, if the image sensorof the camera is coupled to the first horizontal structural member 110,the image sensor can be lowered by the flexure structure 102 in responseto exposure of the piezoelectric material 134 to the relatively coolenvironment. Lowering the image sensor can substantially offset anydistance changes between the image sensor and the lens due to exposureto the relatively cool environment. As a non-limiting example, if thedistance between the image sensor and the lens is shortened byapproximately 105 μm due to a decrease in environmental temperature, theshortened distance can be offset by flexure structure 102 lowering theimage sensor by 105 μm.

Thus, the camera focus adjustment device 100 can move the image sensorto compensate for temperature-based distance fluctuations between theimage sensor and the lens. As a result, the camera can experience arelatively large range of focus capability.

It should be appreciated that the flexure structure 102 experiences asubstantial expansion in the z-direction based on a relatively small ofamount of piezoelectric material 134 contraction in the x-direction. Forexample, the flexure structure 102 can be designed to amplify the motionof the piezoelectric material 134 by at least a factor of seven. Becausethe flexure structure 102 is designed to produce a relatively puretranslation in the z-direction, it should be appreciated thattranslation and rotation in the x-direction and the y-direction issubstantially reduced, which improves camera focus capabilities.

FIGS. 2-5 illustrate a process for manufacturing the camera focusadjustment device 100 of FIG. 1 . In particular, the process for loadingthe piezoelectric material 134 into the flexure structure 102 isdescribed with respect to FIGS. 2-5 .

FIG. 2 is a three-dimensional diagram of the flexure structure 102, inaccordance with an example embodiment. The flexure structure 102includes the outer framework comprised of the structural members 110,112, 114, 116, 122, 124, 126, 128. The flexure structure 102 alsoincludes the horizontal structural members 118, 120 extending from thevertical structural members 114, 116, respectively. As illustrated inFIG. 2 , the flexure structure 102 includes a gap 200 between thehorizontal structural members 118, 120. The gap 200 is used to load thepiezoelectric material 134 using the pair of wedges 130, 132, asdescribed with respect to FIGS. 3-5 .

FIG. 3 is a three-dimensional diagram of the flexure structure 102 withthe piezoelectric material 134, in accordance with an exampleembodiment. For example, as illustrated in FIG. 3 , the piezoelectricmaterial 134 is placed in the gap 200 in a zero stress state. That is,the piezoelectric material 134 is positioned between the horizontalstructural members 118, 120 with little to approximately no stressapplied to the piezoelectric material 134.

FIG. 4 is a three-dimensional diagram of the camera focus adjustmentdevice 100, in accordance with an example embodiment. For example, asillustrated in FIG. 4 , the wedge 130 and the wedge 132 are loadedbetween the third horizontal structural member 118 and the piezoelectricmaterial 134 to add the compressive stress pressure to the piezoelectricmaterial 134.

FIG. 5 is a diagram illustrating the process of loading thepiezoelectric material 134 with the wedges 130, 132, in accordance withan example embodiment. For example, FIG. 5 illustrates the thirdhorizontal structural member 118, the wedge 130, the wedge 132, and thepiezoelectric material 134.

As illustrated in FIG. 5 , the wedge 130 is coupled (e.g., affixed) tothe wedge 132 at a particular angle (α). According to oneimplementation, the wedges 130, 132 are designed such that theparticular angle (α) is equal to 85 degrees. In some non-limitingscenarios, the particular angle (α) can range from 84.5 degrees to 85.5degrees. It should be understood that in different implementations, therange of the particular angle (α) may vary. It should also be understoodthat in some implementations, the wedges 130, 132 may be coupled at a 90degree angle and held in place via an adhesive. However, coupling oraffixing the wedges 130, 132 at the particular angle (α) may ensure thatfriction holds the wedges 130, 132 in place when a force, such as aparticular load force (Fz), is removed.

As illustrated in FIG. 5 , the wedge 132 is positioned (e.g., wedged)between the third horizontal structural member 118 and the piezoelectricmaterial 134. After the wedge 132 is positioned, the wedge 130 ispositioned (e.g., wedged) between the wedge 132 and the third horizontalstructural member 118 using a particular load force (Fz). According toone implementation, the particular load force (Fz) can be 26 Newtons (N)applied to the wedge 130 along the z-direction to load the piezoelectricmaterial 134 with a compressive stress pressure of approximately 15 MPa.That is, the particular load force (Fz) of 26 N can create an axialforce of 90 N in the x-direction using the 85 degree wedges 130, 132 toload (e.g., pre-load) the piezoelectric material 134 with thecompressive stress pressure of approximately 15 MPa. Pre-loading thepiezoelectric material 134 with the wedges 130, 132 may cause theflexure structure 102 to contract by approximately 75 μm in thez-direction and may cause the piezoelectric material 134 to contract byapproximately 6 μm in the x-direction.

By pre-loading the piezoelectric material 134 with the wedges 130, 132,an external pre-load spring may be unnecessary. Once the piezoelectricmaterial 134 is loaded and the particular load force (Fz) is removed, itwill be appreciated that friction may hold the wedges 130, 132 in place.Thus, the friction between the wedges 130, 132 is used to maintain thecompressive stress pressure of the piezoelectric material 134. However,in certain implementations, an adhesive 500 (e.g., anultraviolet-curable adhesive) may be used between the flexure structure102, the wedges 130, 132, and the piezoelectric material 134.

FIG. 6 is a diagram of a camera 600 that includes the camera focusadjustment device 100, in accordance with an example embodiment. Asshown in FIG. 6 , the camera 600 includes a fixed surface 602, thecamera focus adjustment device 100, an image sensor board 604, an imagesensor 606, and a lens 608. It should be understood that the camera 600can include other components that are not illustrated in FIG. 6 . Asnon-limiting examples, the camera 600 can also include a lens mount, aflash, a shutter, a mirror, a filter, etc.

The second horizontal structural member 112 of the camera focusadjustment device 100 can be rigidly affixed to the fixed surface 602.Rigidly affixing the second horizontal structural member 112 to thefixed surface 602 may prevent movement of the second horizontalstructural member 112 when the piezoelectric material 134 expands orcontracts. That is, the camera focus adjustment device 100 can collapseto the second horizontal structural member 112 or raise from the secondhorizontal structural member 112, but the position of the secondhorizontal structural member 112 is fixed.

As illustrated in FIG. 6 , the first horizontal structural member 110 ofthe camera focus adjustment device 100 can be affixed (e.g., coupled) tothe image sensor board 604, and the image sensor 606 is coupled to theimage sensor board 604. According to one implementation, the imagesensor 606 is positioned within a threshold distance from the lens 608of the camera 600 to provide the camera 600 a range of image focuscapability. As a non-limiting example, the image sensor 606 can bepositioned within ten (10) micrometers (μm) of the lens 608 to providethe camera 600 a range of image focus capability.

However, in some scenarios, the distance between the image sensor 606and the lens 608 can fluctuate based on temperature. For example, thedistance between the image sensor 606 and the lens 608 may expand inwarmer temperatures, and the distance between the image sensor 606 andthe lens 608 may contract in cooler temperatures.

To adjust for distance fluctuations between the image sensor 606 and thelens 608, the camera focus adjustment device 100 is operable tovertically translate (e.g., translate in the z-direction) based ontemperature-based piezoelectric activity associated with piezoelectricmaterial 134. For example, contraction of the piezoelectric material 134in warm environments can cause the flexure notch hinges 150 of thecamera focus adjustment device 100 to displace (e.g., raise) the camerafocus adjustment device 100 in the z-direction. To illustrate, when thepiezoelectric material 134 contracts in the x-direction, the flexurenotch hinges 150 raise the camera focus adjustment device 100. As aresult, the image sensor board 604 coupled to the first horizontalstructural member 110, and thus the image sensor 606, is raised suchthat the image sensor 606 is vertically translated (in the z-direction)to be closer to the lens 608. Thus, in warmer temperatures where thedistance between the image sensor 606 and the lens 608 expands to apoint whereby the focus capability of the camera 600 is potentiallycompromised, the camera focus adjustment device 100 can raise the imagesensor 606 closer to the lens 608 to improve the focus capability of thecamera 600.

Alternatively, expansion of the piezoelectric material 134 in coolenvironments can cause the flexure notch hinges 150 of the camera focusadjustment device 100 to displace (e.g., lower) the camera focusadjustment device 100 in the z-direction. To illustrate, when thepiezoelectric material 134 expands in the x-direction, the flexure notchhinges 150 lower the camera focus adjustment device 100. As a result,the image sensor board 604 coupled to the first horizontal structuralmember 110, and thus the image sensor 606, is lowered such that theimage sensor 606 is vertically translated (in the z-direction) to befurther from the lens 608. Thus, in cooler temperatures where thedistance between the image sensor 606 and the lens 608 contracts to apoint whereby the focus capability of the camera 600 is potentiallycompromised, the camera focus adjustment device 100 can lower the imagesensor 606 from the lens 608 to improve the focus capability of thecamera 600.

Thus, the camera focus adjustment device 100 is operable to control thedistance between the image sensor 606 and the lens 608 over a relativelylarge temperature range to ensure the camera 600 has relatively highfocus capabilities. For example, the camera focus adjustment device 100can move the image sensor 606 to compensate for fluctuations in thedistance between the image sensor 606 and the lens 608 based ontemperature.

The camera focus adjustment device 100 provides additional benefits tothe camera 600. For example, because the camera focus adjustment device100 does not include any sliding elements, such as bearing or leadscrews, the camera 600 may not be subject to backlash or particlegeneration that is associated with sliding elements. Additionally, thecamera focus adjustment device 100 can maintain or hold the image sensor606 at a constant distance from the lens 608 without using power, whichmay result in increased power savings.

By moving the image sensor 606, the camera focus adjustment device 100can adjust the distance between the image sensor 606 and the lens 608while keeping the camera 600 sealed from external elements that thecamera 600 may otherwise be exposed to if the lens 608 is moved.Additionally, the camera focus adjustment device 100 is subject to areduced load compared to conventional devices that move the lens 608because the lens 608 is heavier than the image sensor 606.

FIG. 7 is a three-dimensional diagram of the camera focus adjustmentdevice 100 coupled to the image sensor 606 of the camera 606, inaccordance with an example embodiment. As illustrated in FIG. 7 , theimage sensor board 604 is positioned on top of the camera focusadjustment device 100, and the image sensor 606 is coupled to the imagesensor board 604. The camera focus adjustment device 100 is configuredto raise the image sensor board 604, and thus the image sensor 606, inthe z-direction in response to the piezoelectric material 134contracting. For example, contraction of the piezoelectric material 134may cause the flexure structure 102 to expand in the z-direction, whichin turn, raises the image sensor 606.

Because the flexure structure 102 is designed to produce a relativelypure translation in the z-direction, it should be appreciated thatflexure structure 102 reduces translation and rotation in thex-direction and the y-direction.

FIG. 8 is a diagram of an autonomous vehicle 800, in accordance with anexample embodiment. Although the autonomous vehicle 800 is illustratedas a car, in other implementations, the autonomous vehicle 800 may takethe form of a truck, motorcycle, bus, boat, airplane, helicopter, lawnmower, earth mover, snowmobile, aircraft, recreational vehicle,amusement park vehicle, farm equipment, construction equipment, tram,golf cart, train, and trolley, for example. Other vehicles are possibleas well. The autonomous vehicle 100 may be configured to operate fullyor partially in an autonomous mode. For example, the autonomous vehicle100 may control itself while in the autonomous mode, and may be operableto determine a current state of the autonomous vehicle 100 and itsenvironment, determine a predicted behavior of at least one othervehicle in the environment, determine a confidence level that maycorrespond to a likelihood of the at least one other vehicle to performthe predicted behavior, and control the autonomous vehicle 100 based onthe determined information. While in the autonomous mode, the autonomousvehicle 100 may be configured to operate without human interaction.

In FIG. 8 , the camera 600 is coupled to a roof 802 of the autonomousvehicle 800. Although illustrated as coupled to the roof 802, in otherimplementations, the camera 600 can be coupled to other components ofthe autonomous vehicle 800. The camera 600 includes the componentsillustrated in FIG. 6 , such as the fixed surface 602, the camera focusadjustment device 100, the image sensor board 604, the image sensor 606,and the lens 608. The camera 600 may be a high-resolution cameraoperable to capture high-resolution images of the environmentsurrounding the autonomous vehicle 800.

The flexure structure 102 of the camera focus adjustment device 100 canhave a stiffness quality that passively rejects vibrations, such asautomotive vibration of the autonomous vehicle 800. For example, thedesign and material of the flexure structure 102 may result in theflexure structure 102 remaining substantially steady despite externalvibrations of surfaces coupled to the flexure structure 102. Thus, theflexure structure 102 experiences little to no movement based onexternal vibrations.

III. EXAMPLE METHODS

FIG. 9 is a flowchart of a method 900, according to an exampleembodiment. The method 900 can be performed by manufacturing equipment.

The method 900 includes inserting piezoelectric material in a gapbetween two inner structural members of a flexure structure of a camerafocus adjustment device, at 902. The flexure structure includes an outerframework of structural members continuously interconnected by flexurenotch hinges and the two inner structural members. The two innerstructural members are oriented in parallel and extending from the outerframework of the structural members. For example, referring to FIGS. 2-3, the piezoelectric material 134 is inserted, in a zero stress state, inthe gap 200 between the horizontal structural members 118, 120. Theflexure structure 112 includes the outer framework of structural members110, 112, 114, 116, 122, 124, 126, 128 continuously interconnected bythe flexure notch hinges 150. The flexure structure 102 also includesthe two inner structural members 118, 120.

The method 900 also includes applying a compressive stress pressure tothe piezoelectric material by loading a first wedge between a firstinner structural member of the two inner structural members and thepiezoelectric material, at 904. For example, referring to FIGS. 4-5 ,compressive stress pressure is applied to the piezoelectric material 134by loading the wedge 132 between the structural member 118 and thepiezoelectric material 134.

The method 900 further includes applying additional compressive stresspressure to the piezoelectric material by loading a second wedge betweenthe first inner structural member and the first wedge, at 906. In someimplementations, the first wedge and the second wedge are affixed at anangle to ensure friction holds the wedges in place when a force isremoved. For example, referring to FIGS. 4-5 , additional compressivestress pressure is applied to the piezoelectric material by loading thewedge 130 between the structural member 118 and the wedge 132. Accordingto one non-limiting implementation, the wedges 130, 132 may be affixedat an 85 degree angle. However, it should be understood that the wedges130, 132 may be affixed at different angles in other implementations. Asillustrated in FIG. 5 , according to one implementation, a particularload force (Fz) of 26 Newtons (N) can be applied to the wedge 130 alongthe z-direction to load the piezoelectric material 134 with acompressive stress pressure of approximately 15 MPa. That is, theparticular load force (Fz) of 26 N can create an axial force of 90 N inthe x-direction using the 85 degree wedges 130, 132 to load (e.g.,pre-load) the piezoelectric material 134 with the compressive stresspressure of approximately 15 MPa. Pre-loading the piezoelectric material134 with the wedges 130, 132 may cause the flexure structure 102 tocontract by approximately 75 μm in the z-direction and may cause thepiezoelectric material 134 to contract by approximately 6 μm in thex-direction.

By pre-loading the piezoelectric material 134 with the wedges 130, 132,the use of an external pre-load spring can be bypassed. Once thepiezoelectric material 134 is loaded and the particular load force (Fz)is removed, it will be appreciated that friction may hold the wedges130, 132 in place. Thus, the friction between the wedges 130, 132 isused to maintain the compressive stress pressure. However, in certainimplementations, an adhesive 500 may be used between the flexurestructure 102, the wedges 130, 132, and the piezoelectric material 134.

IV. CONCLUSION

The particular arrangements shown in the Figures should not be viewed aslimiting. It should be understood that other embodiments may includemore or less of each element shown in a given Figure. Further, some ofthe illustrated elements may be combined or omitted. Yet further, anillustrative embodiment may include elements that are not illustrated inthe Figures.

A step or block that represents a processing of information cancorrespond to circuitry that can be configured to perform the specificlogical functions of a herein-described method or technique.Alternatively or additionally, a step or block that represents aprocessing of information can correspond to a module, a segment, or aportion of program code (including related data). The program code caninclude one or more instructions executable by a processor forimplementing specific logical functions or actions in the method ortechnique. The program code and/or related data can be stored on anytype of computer readable medium such as a storage device including adisk, hard drive, or other storage medium.

The computer readable medium can also include non-transitory computerreadable media such as computer-readable media that store data for shortperiods of time like register memory, processor cache, and random accessmemory (RAM). The computer readable media can also includenon-transitory computer readable media that store program code and/ordata for longer periods of time. Thus, the computer readable media mayinclude secondary or persistent long term storage, like read only memory(ROM), optical or magnetic disks, compact-disc read only memory(CD-ROM), for example. The computer readable media can also be any othervolatile or non-volatile storage systems. A computer readable medium canbe considered a computer readable storage medium, for example, or atangible storage device.

While various examples and embodiments have been disclosed, otherexamples and embodiments will be apparent to those skilled in the art.The various disclosed examples and embodiments are for purposes ofillustration and are not intended to be limiting, with the true scopebeing indicated by the following claims.

What is claimed is:
 1. A camera focus adjustment device comprising: aflexure structure comprising: an outer framework of structural memberscontinuously interconnected by flexure notch hinges; and two innerstructural members oriented in parallel and extending from the outerframework of structural members, wherein a gap is between the two innerstructural members; a piezoelectric material within the gap; and a pairof wedges within the gap, wherein the pair of wedges comprises a firstwedge affixed to the piezoelectric material and a second wedge affixedto one inner structural member of the two inner structural members,wherein a distance between outer surfaces of the outer framework isbased on a length of a combination of the two inner structural members,the piezoelectric material, and the pair of wedges.
 2. The camera focusadjustment device of claim 1, wherein displacement of the flexurestructure causes vertical displacement of an image sensor.
 3. The camerafocus adjustment device of claim 1, wherein the first wedge is affixedto the second wedge at an 85 degree angle.
 4. The camera focusadjustment device of claim 1, wherein the piezoelectric material has acompressive stress pressure of approximately 15 Megapascals.
 5. Thecamera focus adjustment device of claim 1, wherein the flexure structureis comprised of 440C stainless steel or 440F stainless steel.
 6. Thecamera focus adjustment device of claim 1, wherein the flexure structurehas a length of approximately 40 millimeters (mm), wherein the flexurestructure has a height of approximately 10 mm, and wherein the flexurestructure has a width of approximately 5 mm.
 7. The camera focusadjustment device of claim 6, wherein the piezoelectric material has alength of approximately 18 mm, wherein the piezoelectric material has aheight of approximately 3 mm, and wherein the piezoelectric material hasa width of approximately 2 mm.
 8. The camera focus adjustment device ofclaim 1, wherein a coefficient of thermal expansion (CTE) of the flexurestructure is approximately 10 parts per million (ppm), and wherein a CTEof the piezoelectric material along an actuation axis is approximately−5 ppm.
 9. The camera focus adjustment device of claim 1, wherein thesecond wedge is affixed to the inner structural member via an adhesive,and wherein the first wedge is affixed to the piezoelectric material viaan adhesive.
 10. The camera focus adjustment device of claim 1, whereinat least a portion of the outer framework is oriented along a threedegree angle with respect to an orientation of the inner structuralmembers.
 11. An apparatus comprising: a camera, the camera comprising: acamera focus adjustment device, the camera focus adjustment devicecomprising: a flexure structure comprising: an outer framework ofstructural members continuously interconnected by flexure notch hinges;and two inner structural members oriented in parallel and extending fromthe outer framework of structural members, wherein a gap is between thetwo inner structural members; a piezoelectric material within the gap;and a pair of wedges within the gap, wherein the pair of wedgescomprises a first wedge affixed to the piezoelectric material and asecond wedge affixed to one inner structural member of the two innerstructural members; a lens; and an image sensor coupled to the camerafocus adjustment device, the image sensor located between the camerafocus adjustment device and the lens, wherein the camera focusadjustment device is operable to move the image sensor relative to thelens.
 12. The apparatus of claim 11, wherein the camera is coupled to anautonomous vehicle.
 13. The apparatus of claim 11, wherein thepiezoelectric material is configured to contract in response to anincrease in environmental temperature, and wherein the flexure structureis operable to expand based on the contraction of the piezoelectricmaterial such that the camera focus adjustment device moves the imagesensor closer to the lens.
 14. The apparatus of claim 11, wherein thepiezoelectric material is configured to expand in response to a decreasein environmental temperature, and wherein the flexure structure isoperable to contract based on the expansion of the piezoelectricmaterial such that the camera focus adjustment device moves the imagesensor farther away from the lens.
 15. The apparatus of claim 11,wherein the first wedge is affixed to the second wedge at an 85 degreeangle.
 16. The apparatus of claim 11, wherein the flexure structure iscomprised of 440C stainless steel or 440F stainless steel.
 17. Theapparatus of claim 11, wherein the flexure notch hinges are manufacturedaccording to a machining process.
 18. The apparatus of claim 11, whereinthe camera focus adjustment device is operable to position the imagesensor within 10 micrometers of the lens.
 19. The apparatus of claim 11,wherein a coefficient of thermal expansion (CTE) of the flexurestructure is approximately 10 parts per million (ppm), and wherein a CTEof the piezoelectric material along an actuation axis is approximately−5 ppm.
 20. The apparatus of claim 11, wherein at least a portion of theouter framework is oriented along a three degree angle with respect toan orientation of the inner structural members.